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Specifications:
|
1 |
Power consumption |
4200W |
|
2 |
Top Heater |
800W |
|
3 |
Bottom Heater |
the 3rd temperature area 800W |
|
4 |
Constant temperature heating power |
2400W |
|
5 |
Power supply |
Single phase 220V/230V 50/60Hz 4.5KVA |
|
6 |
Machine Dimension |
450×550×650mm |
|
7 |
Positioning |
V-groove for PCB positioning, Max PCB size 280×395mm |
|
8 |
Temperature control |
high-precision K sensor |
|
9 |
Weight of machine |
about 30kg |
Features:
1. Choose imported high-precision materials (temperature
sensor, heater) to control the BGA desoldering & soldering
procedures precisely.
2. There are three independent heating areas from top to
bottom. the first and second temperature areas can control
many groups & sections of temperature parameters at the same
time. The third area preheats the PCB thoroughly to achieve
the best welding effect.
3. Choose imported high-precision thermocouple to detect
top/down temperature precisely. With a function of
over-temperature protection.
4. Top & bottom temperature areas heat independently, A
cross-flow fan cools rapidly to protect the PCB from
deformation when welding.
5. After finishing desoldering & soldering, there is an
alarming. The machine is equipped with a vacuum suction pen
to facilitate the removing of BGA after desoldering.
6. Use a V-groove equipped with a flexible fixture for PCB
positioning to protect the PCB.
7.For large thermal capacity of PCB or other
high-temperature and lead-free welding requirements, all can
be handled easily.
Download user manual of ZM-R5820.
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