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HS-BGA IC softens and removes resinating and
sealing glue of chip BGA IC of mobile phones. The
ingredients of it is newestly, environmental protection and
safest. It has good permeability; it can quickly soften and
loosens solidified resin adhesive such as phonetics, epoxy,
acrylate, polyurethane, organosilicon. It does not do harm
to circuit board and component.
Attention: With BGA IC
adhesive Removing Liquid, it shall not touch eyes and skin.
If it is touched by accident, use a lot of clean water to
wash. When finished, it should be sealed with a cap to avoid
volatilizing which will make the effect not good. Be careful
to open it since there is pressure.
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